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FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION 2/E
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內容簡介
This new edition updates the prior edition to address the new developments in the science and its applications, with new chapters on innovative applications of electrochemical deposition in semiconductor technology, magnetism and microelectronics, and medical instrumentation. Added coverage includes such topics as binding energy, nanoclusters, atomic force, and scanning tunneling microscopy.Example problems at the end of chapters and other features clarify and improve understanding of the material.
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TABLE OF CONTENTS:Preface to the Second Edition. Preface to the First Edition. 1. Overview. 2. Water and Ionic Solutions. 3. Metals and Metal Sufaces. 4. Metal-Solution Interphase. 5. Equilibrium Electrode Potential. 6. Kinetics and Mechanism of Electrodeposition. 7. Nucleation and Growth Models. 8. Electroless Deposition. 9. Displacement Deposition. 10. Effect of Additives. 11. Electrodeposition of Alloys. 12. Metal Deposit and Current Distribution. 13. Characterization of metallic Surfaces and Thin Films. 14. In Situ Characterization of Deposition. 15. Mathematical Modeling in Electrochemistry. 16. Structure anad Properties of Deposits. 17. Electrodeposited Multilayers. 18. Interdiffusion in Thin Films. 19. Applications in Semiconductors Technology. 20. Applications in the Fields of Magnetism and Microelectronics. 21. Frontiers in Applications: Applications in the Field of Medicine. Index.
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